Intel Microprocessor Quick Reference Guide


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Learn all the significant processor evolution facts, including introduction date, ratings and number of transistors. Click on the processor family below to view facts on each processor in that family, or scroll down the page to see them all. For a fun and informative overview of Intel processor history, visit the interactive History of the Microprocessor.

View Processors Chronologically by Date of Introduction:

2002  |   2001  |   2000
1999  |   1998  |   1997  |   1996  |   1995
1994  |   1993  |   1992  |   1991  |   1990
1989  |   1988  |   1985  |   1982  |   1979
1978  |   1976  |   1974  |   1972  |   1971

View the Quick Reference Guide by Family

2002

Pentium® 4 Processor built on 0.13-micron process technology (2.53, 2.40, 2.26 GHz)
Introduction date: May 6, 2002
Level Two cache: 512 KB Advanced Transfer Cache (Integrated)
Processor Package Style: PGA478
System Bus Speed: 533 MHz
SSE2 SIMD Extensions
Transistors: 55 Million Typical Use: Desktops and entry-level workstations

Mobile Intel® Pentium® 4 Processor-M (1.80, 1.50, 1.40 GHz)
Introduction date: April 23, 2002
Bus speed: 400 MHz System Bus
Mfg. Process: 0.13 Micron
Cache: 512KB on-die L2 cache
Packaging: Micro-Flip Chip Pin Grid Array (uFCPGA)
Streaming SIMD Extensions (SSE2)
Core Voltage: 1.3 volts in Maximum Performance Mode; 1.2 volts in Battery Optimized Mode
Wattage: <2 watts in Battery Optimized Mode
Typical Use: Full-size and thin & light mobile PCs

Intel® Xeon™ Processor, built on 0.13-micron process technology (2.40 GHz)
Introduction date: April 23, 2002
Hyper-Threading Technology: Enabled for servers
Level Two cache: 512 KB Advanced Transfer Cache (Integrated)
Processor Package Style: 603-pin micro-PGA (Pin-Grid Array)
System Bus Speed: 400 MHz
SSE2 SIMD Extensions
Typical Use: High-performance and mid-range dual processor enabled workstations and servers based on the Intel® E7500 Chipset and 3rd party chipsets

Ultra Low Voltage Mobile Intel® Pentium® III Processor-M (800 MHz)
Introduction date: April 17, 2002
Clock speeds: 800 MHz / 400 MHz Battery Optimized
Cache: 512K Advanced Transfer Cache (Integrated)
Packaging: Micro-FCPGA, Micro-FCBGA (Flip Chip Pin Grid Array, and Flip Chip Ball Grid Array)
Bus Speed: 100 MHz Front Side Bus
Voltage: 1.15V; 1.05V Battery Optimized
Wattage: <0.5 Watt Battery Optimized
Typical Use: Mini- and Sub-notebooks, Ultra-dense blade servers

Ultra Low Voltage Mobile Intel® Pentium® III Processor-M (800 MHz)
Introduction date: April 17, 2002
Clock speeds: 800 MHz / 400 MHz Battery Optimized
Cache: 512K Advanced Transfer Cache (Integrated)
Packaging: Micro-FCPGA, Micro-FCBGA (Flip Chip Pin Grid Array, and Flip Chip Ball Grid Array)
Bus Speed: 133 MHz Front Side Bus
Voltage: 1.15V; 1.05V Battery Optimized
Wattage: <0.5 Watt Battery Optimized
Typical Use: Mini- and Sub-notebooks

Low Voltage Mobile Intel® Pentium® III Processor-M (933 MHz)
Introduction date: April 17, 2002
Clock speeds: 933 MHz / 533 MHz Battery Optimized
Cache: 512K Advanced Transfer Cache (Integrated)
Packaging: Micro-FCPGA, Micro-FCBGA (Flip Chip Pin Grid Array, and Flip Chip Ball Grid Array)
Bus Speed: 133 MHz Front Side Bus
Voltage: 1.15V; 1.05V Battery Optimized
Wattage: <1 Watt Battery Optimized
Typical Use: Mini- and Sub-notebooks

Low Voltage Mobile Celeron® Processor (733 MHz)
Introduction date: April 17, 2002
Cache: 256K Advanced Transfer Cache
0.13 Micron process
Packaging: Micro-FCPGA, Micro-FCBGA (Flip Chip Pin Grid Array, and Flip Chip Ball Grid Array)
Bus Speed: 100 MHz
Voltage: 1.15V
Typical Use: Value Ultra-Portable Mobile PCs

Mobile Intel® Celeron® Processor (1 GHz)
Introduction date: April 17, 2002
Bus speed: 133 MHz
0.13-Micron process
256K on-die L2 Cache
Streaming SIMD extensions
Ball Grid Array (BGA2) and Pin Grid Array (PGA2)
Core voltage: 1.4 volts
Typical use: Value/low-cost mobile PCs

Pentium® 4 Processor built on 0.13-micron process technology (2.4, 2.2, 2 GHz)
Introduction date: April 2, 2002
Level Two cache: 512 KB Advanced Transfer Cache (Integrated)
Processor Package Style: PGA478
System Bus Speed: 400 MHz
SSE2 SIMD Extensions
Transistors: 55 Million Typical Use: Desktops and entry-level workstations

Intel® Xeon™ Processor MP (1.6, 1.5, 1.4 GHz)
Introduction date: March 12, 2002
System Bus: 400 MHz Front Side Bus
Mfg. Process: 0.13-Micron
Cache: L3 -- 1 MB or 512KB Integrated Cache
L2 -- 256 KB Advanced Transfer Cache
L1 -- 8 KB Execution Trace Cache
Packaging: Flip Chip Ball Grid Array (FC-BGA)
Streaming SIMD Extensions (SSE2)
Typical Use: Multi-processing mid-tier and back-end servers

Mobile Intel® Pentium® 4 Processor-M with Enhanced Intel® SpeedStep Technology (1.7, 1.6 GHz)
Introduction date: March 4, 2002
Bus speed: 400 MHz System Bus
Mfg. Process: 0.13 Micron
Cache: 512KB on-die L2 cache
Packaging: Micro-Flip Chip Pin Grid Array (uFCPGA)
Streaming SIMD Extensions (SSE2)
Core Voltage: 1.3 volts in Maximum Performance Mode; 1.2 volts in Battery Optimized Mode
Wattage: <2 watts in Battery Optimized Mode
Typical Use: Full-size and thin & light mobile PCs

Intel® Xeon™ Processor, built on 0.13-micron process technology (2.20, 2, and 1.80 GHz)
Introduction date: February 25, 2002
Hyper-Threading Technology: Enabled for servers
Level Two cache: 512 KB Advanced Transfer Cache (Integrated)
Processor Package Style: 603-pin micro-PGA (Pin-Grid Array)
System Bus Speed: 400 MHz
SSE2 SIMD Extensions
Typical Use: High-performance and mid-range dual processor enabled workstations and servers based on the Intel® E7500 Chipset and 3rd party chipsets

Ultra Low Voltage Mobile Pentium® III Processor Featuring Intel® SpeedStep™ Technology (750 MHz)
Introduction date: January 21, 2002
Clock speeds: 750 MHz; 350 MHz (Battery Optimized Mode)
Cache: 512K Advanced Transfer Cache (Integrated)
Packaging: Ball Grid Array (BGA)
Bus Speed: 133 MHz Front Side Bus
Voltage: 1.1V; < 0.95V in Battery Optimized Mode
Wattage: <0.5 watt in Battery Optimized Mode
Typical Use: Business and Consumer Mobile PCs

Low Voltage Mobile Pentium® III Processor-M Featuring Intel® SpeedStep™ Technology (866, 850 MHz)
Introduction date: January 21, 2002
Clock speeds: 866 MHz / 533 MHz Battery Optimized; 850 Mhz / 500 MHz Battery Optimized
Cache: 512K Advanced Transfer Cache (Integrated)
Packaging: Ball Grid Array (BGA)
Bus Speed: 133 MHz Front Side Bus
Voltage: 1.15V; 1.05V Battery Optimized
Wattage: <1 Watt Battery Optimized
Typical Use: Business and Consumer Mobile PCs

Ultra Low Voltage Mobile Celeron® Processor (650 MHz)
Introduction date: January 21, 2002
Cache: 256K on-die L2 Cache
0.13-Micron process Packaging: Ball Grid Array (BGA)
Bus Speed: 133 MHz Front Side Bus
Voltage: 1.1V
Wattage: < 1 watt
Typical Use: Business and Consumer Mobile PCs

Mobile Intel® Celeron® Processor (1.2, 1.13, 1.06 GHz)
Introduction date: January 21, 2002
Bus speed: 133 MHz
0.13-Micron process
256K on-die L2 Cache
Streaming SIMD extensions
Ball Grid Array (BGA2) and Pin Grid Array (PGA2)
Core voltage: 1.45 volts
Typical use: Value/low-cost mobile PCs

Intel® Xeon™ Processor, built on 0.13-micron process technology (2.20, 2, and 1.80 GHz)
Introduction date: January 9, 2002
Level Two cache: 512 KB Advanced Transfer Cache (Integrated)
Processor Package Style: 603-pin micro-PGA (Pin-Grid Array)
System Bus Speed: 400 MHz
SSE2 SIMD Extensions
Typical Use: High-performance and mid-range dual processor enabled workstations and servers

Pentium® III Processor for servers, built on 0.13-micron process technology (1.40 GHz)
Introduction date: Jan. 8, 2002
Clock Speeds: 1.40 GHz
0.13 Micron Process
L2 cache: 512 KB
Processor Package Style: Flip Chip Pin Grid Array 2 (FCPGA2)
System Bus Speed: 133 MHz
Typical Use: Rack-mounted and pedestal front-end application servers, and ultra-dense servers

Pentium® 4 Processor built on 0.13-micron process technology (2.20, 2 GHz)
Introduction date: January 7, 2002
Level Two cache: 512 KB Advanced Transfer Cache (Integrated)
Processor Package Style: PGA478
System Bus Speed: 400 MHz
SSE2 SIMD Extensions
Transistors: 55 Million Typical Use: Desktops and entry-level workstations

Intel® Celeron® Processor (1.30 GHz)
Introduction date: January 3, 2002
Clock speeds: 1.30 GHz
Bus speed: 100 MHz System Bus
Mfg. Process: 0.13 Micron
Cache: 256KB on-die L2 cache
Packaging: FCPGA
SIMD Extensions
Typical Use: Value PCs

2001

Ultra-Low Voltage Intel® Pentium® III Processor 512K
Introduction date: November 13, 2001
Clock speeds: 700 MHz
Bus speed: 100 MHz System Bus
Mfg. Process: 0.13 Micron
Cache: 512KB on-die L2 cache
Packaging: uFCBGA
SIMD Extensions
Core Voltage: 1.1 volts
Typical Use: Ultra-dense Servers

Intel® Celeron® Processor (1.20 GHz)
Introduction date: October 2, 2001
Clock speeds: 1.20 GHz
Bus speed: 100 MHz System Bus
Mfg. Process: 0.13 Micron
Cache: 256KB on-die L2 cache
Packaging: FCPGA
SIMD Extensions
Typical Use: Value PCs

Mobile Intel® Pentium® III Processor-M (1.20 GHz)
Introduction date: October 1, 2001
Clock speeds: 1.20 GHz
Bus speed: 133 MHz System Bus
Mfg. Process: 0.13 Micron
Cache: 512KB on-die L2 cache
Packaging: Micro FCBGA/PGA
SIMD Extensions
Core Voltage: 1.4 volts in Maximum Performance Mode; 1.15 volts in Battery Optimized Mode
Wattage: <2 watts in Battery Optimized Mode
Typical Use: Full-size and thin & light mobile PCs

Intel® Xeon™ Processor (2 GHz)
Introduction date: September 25, 2001(
Level Two cache: 256 KB Advanced Transfer Cache (Integrated)
Processor Package Style: Organic Lan Grid Array 603 (OLGA 603)
System Bus Speed: 400 MHz
SSE2 SIMD Extensions
Typical Use: High-performance and mid-range dual processor enabled workstations

Intel® Celeron® Processor (1.10 GHz, 1 GHz, 950 MHz)
Introduction date: August 31, 2001
Cache: 128Kb on-die
Packaging: Flip-Chip Pin Grid Array (FC-PGA)
Bus Speed: 100 MHz
Voltage: 1.5V
Wattage: 18
Die Size: 1.046cm²
Addressable Memory: 4 Gigabytes
Typical Use: Value PCs

Intel® Pentium® 4 Processor built on 0.18-micron process technology (2, 1.90 GHz)
Introduction date: August 27, 2001
Level Two cache: 256 KB Advanced Transfer Cache (Integrated)
Processor Package Style: PGA423, PGA478
System Bus Speed: 400 MHz
SSE2 SIMD Extensions
Transistors: 42 Million Typical Use: Desktops and entry-level workstations

Mobile Intel® Pentium® III Processor-M
Introduction date: July 30, 2001
Clock speeds: 1.13 GHz; 1.06 GHz; 1 GHz
Bus speed: 133 MHz System Bus
Mfg. Process: 0.13 Micron
Cache: 512KB on-die L2 cache
Packaging: Micro FCBGA/PGA
SIMD Extensions
Core Voltage: 1.4 volts in Maximum Performance Mode; 1.15 volts in Battery Optimized Mode
Wattage: <2 watts in Battery Optimized Mode
Typical Use: Full-size and thin & light mobile PCs

Mobile Intel® Pentium® III Processor-M
Introduction date: July 30, 2001
Clock speeds: 933 MHz; 866 MHz
Bus speed: 133 MHz System Bus
Mfg. Process: 0.13 Micron
Cache: 512KB on-die L2 cache
Packaging: Micro FCBGA/PGA
SIMD Extensions
Core Voltage: 1.15 volts in Maximum Performance Mode; 1.05 volts in Battery Optimized Mode
Wattage: <1 watt in Battery Optimized Mode
Typical Use: Full-size and thin & light mobile PCs

Pentium® 4 Processor built on 0.18-micron process technology (1.80, 1.60 GHz)
Introduction date: July 2, 2001
Level Two cache: 256 KB Advanced Transfer Cache (Integrated)
Processor Package Style: PGA423
System Bus Speed: 400 MHz
SSE2 SIMD Extensions
Transistors: 42 Million Typical Use: Desktops and entry-level workstations

Mobile Intel® Celeron® Processor (850 MHz)
Introduction date: July 2, 2001
Clock speeds: 450 - 750 MHz; Performance data
Bus speed: 100 MHz
0.18 Micron process, 128K on-die L2 Cache
Streaming SIMD extensions
Ball Grid Array (BGA2) and Pin Grid Array (PGA2)
Core voltage: 1.6 volts
Typical use: Value/low-cost mobile PCs

Intel® Celeron® Processor (900 MHz)
Introduction date: July 2, 2001
Clock speeds: 800 MHz; Performance data
Cache: 128Kb on-die
Packaging: Flip-Chip Pin Grid Array (FC-PGA)
Bus Speed: 100 MHz
Voltage: 1.5V
Wattage: 18
Die Size: 1.046cm²
Addressable Memory: 4 Gigabytes
Typical Use: Value PCs

Intel® Xeon™ Processor (1.70, 1.50, and 1.40 GHz)
Introduction date: May 21, 2001
Level Two cache: 256 KB Advanced Transfer Cache (Integrated)
Processor Package Style: Organic Lan Grid Array 603 (OLGA 603)
System Bus Speed: 400 MHz
SSE2 SIMD Extensions
Typical Use: High-performance and mid-range dual processor enabled workstations

Ultra Low Voltage Mobile Pentium® III Processor Featuring Intel® SpeedStep™ Technology (600 MHz)
Introduction date: May 21, 2001
Clock speeds: 600 MHz; 300 MHz (Battery Optimized Mode)
Cache: 256K Advanced Transfer Cache (Integrated)
Packaging: Ball Grid Array (BGA)
Bus Speed: 100 MHz Front Side Bus
Voltage: 1.1V at 600 MHz; < 1V in Battery Optimized Mode
Wattage: < 1 watt at 600 MHz; < 0.5 watt at 300 MHz
Typical Use: Business and Consumer Mobile PCs

Low Voltage Mobile Pentium® III Processor with Intel® SpeedStep™ Technology (750 MHz)
Introduction date: May 21, 2001
Level Two cache: 256 KB Advanced Transfer Cache (Integrated)
0.18-micron process
Processor Package Style: Ball Grid Array (BGA2)
System Bus Speed: 100 MHz
Streaming SIMD extensions
Core Voltage: 1.1 volts (Battery Optimized Mode)
Watts: Average Less than 1 watt (Battery Optimized Mode) Typical Use: Business, Consumer, Education

Ultra Low Voltage Mobile Celeron® Processor (600 MHz)
Introduction date: May 21, 2001
Clock speeds: 600 MHz
Cache: 128K on-die L2 Cache
Packaging: Ball Grid Array (BGA)
Bus Speed: 100 MHz Front Side Bus
Voltage: 1.1V
Wattage: < 1 watt
Typical Use: Business and Consumer Mobile PCs

Low Voltage Mobile Celeron® Processor (600 MHz)
Introduction date: May 21, 2001
Clock speeds: 600 MHz
Cache: 256K Advanced Transfer Cache
0.18 Micron process
Packaging: Ball Grid Array (BGA)
Bus Speed: 100 MHz
Voltage: 1.35V
Wattage: < 2 watts
Typical Use: Value Ultra-Portable Mobile PCs

Mobile Intel® Celeron® Processor (800 MHz)
Introduction date: May 21, 2001
Clock speeds: 800 MHz
Bus speed: 100 MHz
0.18 Micron process, 128K on-die L2 Cache
Streaming SIMD extensions
Packaging: Ball Grid Array (BGA2) and Pin Grid Array (PGA2)
Core Voltage: 1.6 volts Typical use: Value/low-cost mobile PCs

Intel® Celeron® Processor (850 MHz)
Introduction date: May 21, 2001
Clock speeds: 850 MHz; Performance data
Cache: 128Kb on-die L2 Cache
Packaging: Flip-Chip Pin Grid Array (FC-PGA)
Bus Speed: 100 MHz
Voltage: 1.5V
Wattage: 18
Die Size: 1.046cm²
Addressable Memory: 4 Gigabytes
Typical Use: Value PCs

Intel® Itanium™ Processor (800 and 733 MHz)
Introduction Date: May 2001
Manufacturing Process: 0.18-micron
Level 3 Cache: 2MB and 4MB L3 cache
Typical Use: Demanding enterprise-class servers, workstations and high-performance computing applications

Pentium® 4 Processor built on 0.18-micron process technology (1.70 GHz)
Introduction date: April 23, 2001 (1.70 GHz)
Level Two cache: 256 KB Advanced Transfer Cache (Integrated)
Processor Package Style: PGA423
System Bus Speed: 400 MHz
SSE2 SIMD Extensions
Transistors: 42 Million Typical Use: Desktops and entry-level workstations

Pentium® III Xeon™ Processor built on 0.18-micron process technology (900 MHz)
Introduction date: March 21, 2001 (900 MHz)
Level Two cache: 2 MB Advanced Transfer Cache (Integrated)
Processor Package Style: SC330
System Bus Speed: 100 MHz
System Bus Width: 64 bit system bus
Addressable Memory: 64 Gigabytes
Typical Use: High-end servers, 4- and 8-way multiprocessing systems

Mobile Pentium® III Processor with Intel® SpeedStep™ Technology (1 GHz, 900 MHz)
Introduction date: March 19, 2001
Level Two cache: 256 KB Advanced Transfer Cache (Integrated)
0.18-micron process
Processor Package Style: Ball Grid Array (BGA2) or Micro Pin Grid Array (Micro-PGA2)
System Bus Speed: 100 MHz
Streaming SIMD extensions
Addressable Memory: 64 Gigabytes
Core Voltage: 1.35 volts in Battery Optimized Mode
Watts: < 2 watts Typical Use: Business and Consumer PCs

Low Voltage Pentium® III Processor for Applied Computing (700 MHz)
Introduction date: March 19, 2001 (700 MHz)
Level Two cache: 256 KB Advanced Transfer Cache (Integrated)
0.18-micron process
Processor Package Style: Ball Grid Array (BGA)
System Bus Speed: 100 MHz
Streaming SIMD extensions
Addressable Memory: 64 Gigabytes
Core Voltage: 1.35 volts
Watts: < TDPmax = 16.1 watts Typical Use: Small form factor boards, rack mount communication applications

Mobile Intel® Celeron® Processor (750 MHz)
Introduction date: March 19, 2001
Clock speeds: 750 MHz; Performance data
Bus speed: 100 MHz
0.18 Micron process, 128K on-die L2 Cache
Streaming SIMD extensions
Packaging: Ball Grid Array (BGA2) and Pin Grid Array (PGA2)
Core Voltage: 1.6 volts Typical use: Value/low-cost mobile PCs

Low Voltage Mobile Pentium® III Processor with Intel® SpeedStep™ Technology (700, 600 MHz)
Introduction date: Feb. 27, 2001 (700 MHz); June 19, 2000 (600 MHz)
Level Two cache: 256 KB Advanced Transfer Cache (Integrated)
0.18-micron process
Processor Package Style: Ball Grid Array (BGA2)
System Bus Speed: 100 MHz
Streaming SIMD extensions
Core Voltage: 1.1 volts (Battery Optimized Mode)
Watts: Average Less than 1 watt (Battery Optimized Mode) Typical Use: Business, Consumer, Education

Ultra Low Voltage Mobile Pentium® III Processor Featuring Intel® SpeedStep™ Technology (500 MHz)
Introduction date: January 30, 2001 (500 MHz)
Clock speeds: 500 MHz; 300 MHz (Battery Optimized Mode)
Cache: 256K Advanced Transfer Cache (Integrated)
Packaging: Ball Grid Array (BGA)
Bus Speed: 100 MHz Front Side Bus
Voltage: 1.1V at 500 MHz; < 1V in Battery Optimized Mode
Wattage: < 1 watt at 500 MHz; < 0.5 watt at 300 MHz
Typical Use: Business and Consumer Mobile PCs

Ultra Low Voltage Mobile Celeron® Processor (500 MHz)
Introduction date: January 30, 2001
Clock speeds: 500 MHz Performance data
Cache: 128K on-die L2 Cache
Packaging: Ball Grid Array (BGA)
Bus Speed: 100 MHz Front Side Bus
Voltage: 1.1V
Wattage: < 1 watt
Typical Use: Business and Consumer Mobile PCs

Intel® Celeron® Processor (800 MHz)
Introduction date: January 3, 2001
Clock speeds: 800 MHz; Performance data
Cache: 128Kb on-die L2 Cache
Packaging: Flip-Chip Pin Grid Array (FC-PGA)
Bus Speed: 100 MHz
Voltage: 1.5V
Wattage: 18
Die Size: 1.046cm²
Addressable Memory: 4 Gigabytes
Typical Use: Value PCs

2000

Pentium® 4 Processor built on 0.18-micron process technology (1.50, and 1.40 GHz)
Introduction date: November 20, 2000
Level Two cache: 256 KB Advanced Transfer Cache (Integrated)
Processor Package Style: PGA423
System Bus Speed: 400 MHz
SSE2 SIMD Extensions
Transistors: 42 Million Typical Use: Desktops and entry-level workstations

Intel® Celeron® Processor (766 and 733 MHz)
Introduction date: November 13, 2000
Clock speeds: 766 and 733 MHz; Performance data
Cache: 128Kb on-die
Packaging: Flip-Chip Pin Grid Array (FC-PGA)
Bus Speed: 66 MHz
Voltage: 1.5V
Wattage: 18
Die Size: 1.046cm²
Addressable Memory: 4 Gigabytes
Typical Use: Value PCs

Mobile Pentium® III Processor with Intel® SpeedStep™ Technology (850, 800 MHz)
Introduction date: September 25, 2000
Level Two cache: 256 KB Advanced Transfer Cache (Integrated)
0.18-micron process
Processor Package Style: Ball Grid Array (BGA2) or Micro Pin Grid Array (Micro-PGA2)
System Bus Speed: 100 MHz
Addressable Memory: 64 Gigabytes
Core Voltage: 1.35 volts
Watts: < 2 watts Typical Use: Business and Consumer PCs

Mobile Intel® Celeron® Processor (700 MHz)
Introduction date: September 25, 2000
Clock speeds: 700 MHz; Performance data
Bus speed: 100 MHz
0.18 Micron process, 128K on-die L2 Cache
Streaming SIMD extensions
Ball Grid Array (BGA2) and Pin Grid Array (PGA2)
Core Voltage: 1.6 volts Typical use: Value/low-cost mobile PCs

Intel® Celeron® Processor (700, 667 and 633 MHz)
Introduction date: June 26, 2000
Clock speeds: 700, 667 and 633 MHz; Performance data
Cache: 128Kb on-die
Packaging: Flip-Chip Pin Grid Array (FC-PGA)
Bus Speed: 66 MHz
Voltage: 1.5V
Wattage: 18
Die Size: 1.046cm²
Addressable Memory: 4 Gigabytes
Typical Use: Value PCs

Low Voltage Mobile Pentium® III Processor with Intel® SpeedStep™ Technology (600 MHz)
Introduction date: June 19, 2000
Level Two cache: 256 KB Advanced Transfer Cache (Integrated)
0.18-micron process
Processor Package Style: Ball Grid Array (BGA2)
System Bus Speed: 100 MHz
Streaming SIMD extensions
Core Voltage: 1.1 volts (Battery Optimized Mode)
Watts: Average 1 watt (Battery Optimized Mode) Typical Use: Business and Consumer PCs

Low Voltage Mobile Intel® Celeron® Processor (500 MHz)
Introduction date: June 19, 2000
Clock speeds: 500 MHz; Performance data
0.18 Micron process, 128K on-die L2 Cache
Streaming SIMD extensions
Ball Grid Array (BGA2)
Core Voltage: 1.35 volts Wattage: < 2 watts Typical use: Value/low-cost mobile PCs

Mobile Pentium® III Processor with Intel® SpeedStep™ Technology (750 MHz)
Introduction date: June 19, 2000
Level Two cache: 256 KB Advanced Transfer Cache (Integrated)
0.18-micron process
Processor Package Style: Ball Grid Array (BGA2) or Micro Pin Grid Array (Micro-PGA2)
System Bus Speed: 100 MHz
Addressable Memory: 64 Gigabytes
Core Voltage: 1.35 volts
Watts: < 2 watts Typical Use: Business and Consumer PCs

Mobile Intel® Celeron® Processor (650, 600 MHz)
Introduction date: June 19, 2000
Clock speeds: 650/600 MHz; Performance data
Bus speed: 100 MHz
0.18 Micron process, 128K on-die L2 Cache
Streaming SIMD extensions
Ball Grid Array (BGA2) and Pin Grid Array (PGA2)
Core Voltage: 1.6 volts Wattage: < 3 watts Typical use: Value/low-cost mobile PCs

Pentium® III and Pentium® III Xeon™ Processors built on 0.18-micron process technology (933 MHz)
Introduction date: May 24, 2000 (933 MHz)
Level Two cache: 256 KB Advanced Transfer Cache (Integrated)
Processor Package Style: Single Edge Contact Cartridge (S.E.C.C. 2), Flip-Chip Pin Grid Array (FC-PGA) and SC330
System Bus Speed: 133 MHz
System Bus Width: 64 bit system bus
Addressable Memory: 64 Gigabytes
Typical Use: Business and consumer PCs, one and two-way servers and workstations

Pentium® III Processor built on 0.18-micron process technology (700 MHz)
Introduction date: May 22, 2000
Level Two cache: 1MB and 2MB Advanced Transfer Cache (Integrated)
Processor Package Style: SC330
System Bus Speed: 100 MHz
System Bus Width: 64 bit system bus
Addressable Memory: 64 Gigabytes
Typical Use: 4- and 8-way servers

Mobile Pentium® III Processor with Intel® SpeedStep™ Technology (700 MHz)
Introduction date: April 24, 2000
Level Two cache: 256 KB Advanced Transfer Cache (Integrated)
0.18-micron process
Processor Package Style: Ball Grid Array (BGA2) or Micro Pin Grid Array (Micro-PGA2)
System Bus Speed: 100 MHz
Addressable Memory: 64 Gigabytes
Typical Use: Business and Consumer PCs

Mobile Intel® Celeron® Processor built on 0.18-micron process (550 MHz)
Introduction date: April 24, 2000
Clock speeds: 550 MHz; Performance data
Bus speed: 100 MHz
0.18 Micron process, 128K on-die L2 Cache
Streaming SIMD extensions
Ball Grid Array (BGA2) and Pin Grid Array (PGA2)
Typical use: Value/low-cost mobile PCs

Pentium® III Xeon™ Processor built on 0.18 micron process technology (866 MHz)
Introduction date: April 10, 2000
Number of transistors: 28 million (0.18-micron process)
Level Two cache: 256 KB Advanced Transfer Cache (Integrated)
Processor Package Style: Single Edge Contact Cartridge (S.E.C.C. 2)
System Bus Speed: 133 MHz
System Bus Width: 64 bit system bus
Addressable Memory: 64 Gigabytes
Typical Use: Typical Use: Two-way servers and workstations

Intel® Celeron® Processor (600 and 566 MHz)
Introduction date: March 29, 2000
Clock speeds: 600, 566 MHz; Performance data
Cache: 128Kb on-die
Packaging: Flip-Chip Pin Grid Array (FC-PGA)
Bus Speed: 66 MHz
Voltage: 1.5V
Wattage: 18
Die Size: 1.046cm²
Addressable Memory: 4 Gigabytes
Typical Use: Value PCs

Pentium® III Processor built on 0.18-micron process technology (866, 850 MHz)
Introduction date: March 20, 2000
Level Two cache: 256 KB Advanced Transfer Cache (Integrated)
Processor Package Style: Single Edge Contact Cartridge (S.E.C.C. and S.E.C.C. 2)
System Bus Speed: 100 and 133 MHz
System Bus Width: 64 bit system bus
Addressable Memory: 64 Gigabytes
Typical Use: Business and consumer PCs, one and two-way servers and workstations

Pentium® III Processor built on 0.18-micron process technology (1.0 GHz)
Introduction date: March 8, 2000
Level Two cache: 256 KB Advanced Transfer Cache (Integrated)
Processor Package Style: Single Edge Contact Cartridge (S.E.C.C. and S.E.C.C. 2)
System Bus Speed: 100 and 133 MHz
System Bus Width: 64 bit system bus
Addressable Memory: 64 Gigabytes
Typical Use: Business and consumer PCs, one and two-way servers and workstations

Mobile Intel® Celeron® Processor (500, 450 MHz)
Introduction date: February 14, 2000
Clock speeds: 500/450 MHz; Performance data
Bus speed: 100 MHz
0.18 Micron process, 128K on-die L2 Cache
Streaming SIMD extensions
Ball Grid Array (BGA2) and Pin Grid Array (PGA2)
Core voltage: 1.6 volts
Typical use: Value/low-cost mobile PCs

Mobile Pentium® III Processor with Intel® SpeedStep™ Technology (650, 600 MHz)
Introduction date: Jan. 18, 2000
Level Two cache: 256 KB Advanced Transfer Cache (Integrated)
Processor Package Style: Ball Grid Array (BGA2) or Micro Pin Grid Array (Micro-PGA2)
System Bus Speed: 100 MHz
Addressable Memory: 64 Gigabytes
Core voltage: 1.6 volts
Typical Use: Business and consumer PCs

Pentium® III Xeon™ Processor built on 0.18 micron process technology (800 MHz)
Introduction date: Jan. 12, 2000
Number of transistors: 28 million (0.18-micron process)
Level Two cache: 256 KB Advanced Transfer Cache (Integrated)
Processor Package Style: Single Edge Contact Cartridge (S.E.C.C. 2)
System Bus Speed: 133 MHz
System Bus Width: 64 bit system bus
Addressable Memory: 64 Gigabytes
Typical Use: Typical Use: Two-way servers and workstations

Intel® Celeron® Processor (533 MHz)
Introduction date: January 4, 2000
Clock speeds: 533 MHz; Performance data
Number of transistors: 19 million (0.25 micron process)
Cache: 128K on-die Packaging: Plastic Pin Grid Array (PPGA), 370 pins
Bus Speed: 66 MHz
Bus Width: 64 bit system bus
Addressable Memory: 4 Gigabytes
Typical Use: Value PCs

1999

Pentium® III Xeon™ Processor built on 0.18 micron process technology (600, 667, and 733MHz)
Introduction date: Oct. 25, 1999 (600, 667, and 733MHz)
Number of transistors: 28 million (0.18-micron process)
Level Two cache: 256 KB Advanced Transfer Cache (Integrated)
Processor Package Style: Single Edge Contact Cartridge (S.E.C.C. 2)
System Bus Speed: 133 MHz
System Bus Width: 64 bit system bus
Addressable Memory: 64 Gigabytes
Typical Use: Typical Use: Two-way servers and workstations

Pentium® III Processor built on 0.18-micron process technology (500, 533, 550, 600, 650, 667, 700, and 733MHz)
Introduction date: Oct. 25, 1999 (500, 533, 550, 600, 650, 667, 700, and 733MHz)
Number of transistors: 28 million (0.18-micron process)
Level Two cache: 256 KB Advanced Transfer Cache (Integrated)
Processor Package Style: Single Edge Contact Cartridge (S.E.C.C. 2) and Flip Chip Pin Grid Array (FCPGA)
System Bus Speed: 100 and 133 MHz
System Bus Width: 64 bit system bus
Addressable Memory: 64 Gigabytes
Typical Use: Business and consumer PCs, one and two-way servers and workstations

Mobile Pentium® III Processor built on 0.18-micron process technology (500, 450, and 400 MHz)
Introduction date: Oct. 25, 1999 (500, 450, and 400 MHz)
Number of transistors: 28 million (0.18-micron process)
Level Two cache: 256 KB Advanced Transfer Cache (Integrated)
Processor Package Style: Mobile Module, Ball Grid Array (BGA) or Micro Pin Grid Array (micro PGA)
System Bus Speed: 100
System Bus Width: 64 bit system bus
Addressable Memory: 64 Gigabytes
Core voltage: 1.6 volts for 500 and 450MHz, 1.35 volts for 400MHz Typical Use: Business and consumer PCs, one and two-way servers and workstations

Mobile Intel® Celeron® Processor (466/433 MHz)
Introduction date: September 15, 1999
Clock speeds: 466/433 MHz; Performance data
Number of transistors: 18.9 million (0.25 micron process), 128K on-die L2 Cache
Ball Grid Array (BGA) Number of balls = 615
Dimensions:Width = 31 mm; Length = 35 mm
Core voltage: 1.9 volts
Thermal design power: 466 MHz = 15.6 watts, 433MHz = 14.5
Typical use: Value/low-cost mobile PCs

Mobile Pentium® II Processor (400 MHz)
Introduction date: June 14, 1999
Clock speeds: 400 MHz; Performance data
Number of transistors: 27.4 million (0.18 micron process), 256 KB on-die L2 Cache
Ball Grid Array (BGA): Number of balls = 615
Dimensions: Width = 31 mm; Length = 35 mm
Core voltage: 1.5 volts
Thermal design power ranges by frequency: 400 MHz = 7.5 watts (Mini-Cartridge)
Typical use: mobile PCs

Mobile Pentium® II Processor (400 MHz)
Introduction date: June 14, 1999
Clock speeds: 400 MHz; Performance data
Number of transistors: 27.4 million (0.25 micron process), 256 KB on-die L2 Cache
Mini-Cartridge and MMC1, MMC2
Core voltage: 1.55 volts (Mini-Cartridge)
Thermal design power ranges by frequency: 400 MHz = 8.7 watts (Mini-Cartridge)
Typical use: mobile PCs

Mobile Intel® Celeron® Processor (400 MHz)
Introduction date: June 14, 1999
Clock speeds: 400 MHz; Performance data
Number of transistors: 18.9 million (0.25 micron process), 128K on-die L2 Cache
Ball Grid Array (BGA) Number of balls = 615
Dimensions:Width = 31 mm; Length = 35 mm
Core voltage: 1.6 volts
Thermal design power: 400 MHz = 9.2 watts
Typical use: Value/low-cost mobile PCs

Mobile Intel® Celeron® Processor (366 MHz)
Introduction date: May 17, 1999
Clock speeds: 366 MHz; Performance data
Number of transistors: 18.9 million (0.25 micron process), 128K on-die L2 Cache
Ball Grid Array (BGA) Number of balls = 615
Dimensions:Width = 32 mm; Length = 37 mm
Core voltage: 1.6 volts
Thermal design power: 9.5 watts
Typical use: Value/low-cost mobile PCs

Intel® Celeron® Processor (466 and 500 MHz)
Introduction date: April 26, 1999 (466 MHz), August 2, 1999 (500 MHz)
Clock speeds: 466, 500 MHz; Performance data
Number of transistors: 19 million (0.25 micron process)
Cache: 128K on-die Packaging: Plastic Pin Grid Array (PPGA), 370 pins
Bus Speed: 66 MHz
Bus Width: 64 bit system bus
Addressable Memory: 4 Gigabytes
Typical Use: Value PCs

Mobile Intel® Celeron® Processor (333 MHz)
Introduction date: April 5, 1999
Clock speeds: 333 MHz; Performance data
Number of transistors: 18.9 million (0.25 micron process), 128K on-die L2 Cache
Ball Grid Array (BGA) Number of balls = 615
Dimensions:Width = 31 mm; Length = 35 mm
Core voltage: 1.6 volts
Thermal design power: 300 MHz = 8.6 watts
Typical use: Value/low-cost mobile PCs

Intel® Celeron® Processor (433 MHz)
Introduction date: March 22, 1999
Clock speeds: 433 MHz; Performance data
Number of transistors: 19 million (0.25 micron process)
Cache: 128K on-die Single Edge Processor Package (SEPP), 242 pins
Plastic Pin Grid Array (PPGA), 370 pins
Bus Speed: 66 MHz
Bus Width: 64 bit system bus
Addressable Memory: 4 Gigabytes
Typical Use: Value PCs

Pentium® III Xeon™ Processor (500 and 550 MHz)
Introduction date: March 17, 1999
Clock Speeds: 500, 550 MHz
Number of transistors: 9.5 million (0.25 micron process)
L2 cache: 512 KB, 1 and 2 Mb
Processor Package Style: Single Edge Contact (S.E.C.) Cartridge 2
System Bus Speed: 100 MHz
System Bus Width: 64 bit system bus
Addressable Memory: 64 Gigabytes
Typical Use: Business PCs, two-, four- and eight-way (and higher) servers and workstations

Pentium® III Processor (450, 500, 550, and 600MHz)
Introduction date: Feb. 26, 1999 (450, 500 MHz), May 17, 1999 (550 MHz), Aug. 2, 1999 (600 MHz)
Clock Speeds: 450, 500, 550, and 600 MHz
Number of transistors: 9.5 million (0.25 micron process)
L2 cache: 512 KB
Processor Package Style: Single Edge Contact Cartridge (S.E.C.C. 2)
System Bus Speed: 100 MHz
System Bus Width: 64 bit system bus
Addressable Memory: 64 Gigabytes
Typical Use: Business and consumer PCs, one and two-way servers and workstations

Mobile Pentium® II Processor (266, 300, 333, and 366 MHz)
Introduction date: January 25, 1999
Clock speeds: 266, 300, 333, and 366 MHz; Performance data
Number of transistors: 27.4 million (0.25 micron process), 256 KB on-die L2 Cache
Ball Grid Array (BGA): Number of balls = 615
Dimensions: Width = 31 mm; Length = 35 mm
Core voltage: 1.6 volts
Thermal design power ranges by frequency: 366 MHz = 9.5 watts; 333 MHz = 8.6 watts; 300 MHz = 7.7 watts; 266 MHz = 7.0 watts
Typical use: mobile PCs

Mobile Intel® Celeron® Processor (266 and 300 MHz)
Introduction date: January 25, 1999
Clock speeds: 266 and 300 MHz; Performance data
Number of transistors: 18.9 million (0.25 micron process), 128K on-die L2 Cache
Ball Grid Array (BGA) Number of balls = 615
Dimensions:Width = 31 mm; Length = 35 mm
Core voltage: 1.6 volts
Thermal design power: 300 MHz = 7.7 watts; 266 MHz = 7.0 watts
Typical use: Value/low-cost mobile PCs

Mobile Pentium® Processor with MMX™ Technology (300 MHz)
Introduction date: January 7, 1999
Clock speeds: 300 MHz
Number of transistors: 4.5 million (0.25 micron process)
Bus width: 64-bit (Note: it is a 32-bit microprocessor)
Addressable memory: ~68 gigabytes
Package dimension: Tape Carrier Package (TCP) 320-pin
Typical use: mobile PCs and mini-notebooks

Pentium® II Xeon™ Processor (450 MHz)
Introduction date: January 5, 1999
Clock speed: 450 MHz
Performance data: Servers, Workstations
L2 cache: 512 KB, 1 MB and 2 MB
Number of transistors: 7.5 million
Processor Package Style: Single Edge Contact (S.E.C.) Cartridge
System Bus Speed: 100 MHz
System Bus Width: 8 bytes
Addressable Memory: 64 GB
Virtual Memory: 64 Terabytes
Package Dimensions: Height 4.8" x Width 6.0" x Depth .73"
Typical Use: Four-way servers and workstations

Intel® Celeron® Processor (400, 366 MHz)
Introduction date: January 4, 1999
Clock speeds: 400, 366 MHz; Performance data
Number of transistors: 19 million (0.25 micron process)
Single Edge Processor Package (SEPP), 242 pins
Plastic Pin Grid Array (PPGA), 370 pins
Bus Speed: 66 MHz
Bus Width: 64 bit system bus
Addressable Memory: 4 Gigabytes
Typical Use: Low-cost PCs

1998

Pentium® II Xeon™ Processor (450 MHz)
Introduction date: October 6, 1998
Clock speed: 450 MHz
Performance data: Workstations, Servers
L2 cache: 512 KB
Number of transistors: 7.5 million
Processor Package Style: Single Edge Contact (S.E.C.) Cartridge
System Bus Speed: 100 MHz
System Bus Width: 8 bytes
Addressable Memory: 64 GB
Virtual Memory: 64 Terabytes
Package Dimensions: Height 4.8" x Width 6.0" x Depth .73"
Typical Use: Dual-processor workstations and servers

Mobile Pentium® II Processor (300 MHz)
Introduction date: September 9, 1998
Clock speeds: 300 MHz; Performance data
Number of transistors: 7.5 million (0.25 micron process), 512K L2
Bus width: 64-bit
Addressable memory: ~68 gigabytes
Mobile mini-cartridge: 240 pins
Mobile module: 280(mmc1)/400(mmc2) pins
Core voltage: 1.6 volts
Thermal design power: 9.0 watts (includes CPU core and 512-KB L2 cache)
Typical use: mobile PCs

Pentium® II Processor (450 MHz)
See the die shot
Introduction date: August 24, 1998
Clock speeds: 450 MHz; Performance data
Number of transistors: 7.5 million (0.25 micron process)
Single Edge Contact Cartridge (S.E.C), 242 pins
Package Dimensions: 5.505" x 2.473" x 0.647"
Bus Speed: 100 MHz
Bus Width: 64 bit system bus
Addressable Memory: 64 Gigabytes
Typical Use: Business and consumer PCs, one and two-way servers and workstations

Intel® Celeron® Processor (333 MHz)
Introduction date: August 24, 1998
Clock speeds: 333 MHz; Performance data
Number of transistors: 19 million (0.25 micron process)
Single Edge Processor Package (SEPP), 242 pins
Bus Speed: 66 MHz
Bus Width: 64 bit system bus
Addressable Memory: 4 Gigabytes
Package Dimensions: 5" x 2.275" x .208"
Typical Use: Low-cost PCs

Intel® Celeron® Processor (300A MHz)
Introduction date: August 24, 1998
Clock speeds: 300 MHz; Performance data
Number of transistors: 19 million (0.25 micron process)
Single Edge Processor Package (SEPP), 242 pins
Bus Speed: 66 MHz
Bus Width: 64 bit system bus
Addressable Memory: 4 Gigabytes
Package Dimensions: 5" x 2.275" x .208"
Typical Use: Low-cost PCs

Pentium® II Xeon™ Processor (400 MHz)
Introduction date: June 29, 1998
Clock speed: 400 MHz
Performance data: Workstations, Servers
L2 cache versions: 512 KB and 1 MB
Number of transistors: 7.5 million
Processor Package Style: Single Edge Contact (S.E.C.) Cartridge
System Bus Speed: 100 MHz
System Bus Width: 8 bytes
Addressable Memory: 64 GB
Virtual Memory: 64 Terabytes
Package Dimensions: Height 4.8" x Width 6.0" x Depth .73"
Typical Use: Midrange and higher servers and workstations

Intel® Celeron® Processor (300 MHz)
Introduction date: June 8, 1998
Clock speeds: 300 MHz; Performance data
Number of transistors: 7.5 million (0.25 micron process)
Single Edge Processor Package (SEPP), 242 pins
Bus Speed: 66MHz
Bus Width: 64 bit system bus
Addressable Memory: 4 Gigabytes
Virtual Memory: 64 Terabytes
Package Dimensions: 5" x 2.275" x .208"
Typical Use: Low-cost PCs

Intel® Celeron® Processor (266 MHz)
Introduction date: April 15, 1998
Clock speeds: 266 MHz; Performance data
Number of transistors: 7.5 million (0.25 micron process)
Single Edge Processor Package (SEPP), 242 pins
Bus Speed: 66MHz
Bus Width: 64 bit system bus
Addressable Memory: 4 Gigabytes
Virtual Memory: 64 Terabytes
Package Dimensions: 5" x 2.275" x .208"
Typical Use: Low-cost PCs

Pentium® II Processor (350 and 400 MHz)
See the die shot
Introduction date: April 15, 1998
Clock speeds: 350, 400 MHz; Performance data
Number of transistors: 7.5 million (0.25 micron process), 512K L2 cache
Single Edge Contact Cartridge (S.E.C), 242 pins
Package Dimensions: 5.505" (13.98cm) x 2.473" (6.28cm) x 0.647" (1.64cm)
Bus Speed: 100 MHz
Typical Use: Business and consumer PCs, one and two-way servers and workstations

Mobile Pentium® II Processor (233 and 266 MHz)
Introduction date: April 2, 1998
Clock speeds: 233, 266 MHz; Performance data
Number of transistors: 7.5 million (0.25 micron process), 512K L2
Bus width: 64-bit
Addressable memory: ~68 gigabytes
Mobile mini-cartridge: 240 pins
Mobile module: 280(mmc1)/400(mmc2) pins
Core voltage: 1.7 volts
Thermal design power: 7.5 watts for 233 MHz, 8.6 watts for 266 MHz (includes CPU core and 512-KB L2 cache)
Typical use: mobile PCs

Pentium® II Processor (333 MHz)
See the die shot
Introduction date: January 26, 1998
Clock speeds: 333MHz (12.8 SPECint95, 9.14 SPECfp95, 8.32 SPECfpbase)
Number of transistors: 7.5 million (0.25 micron process), 512K L2
Bus Width: 64 bit System Bus w/ECC; 64 bit Cache Bus w/opt. ECC
Addressable Memory: 64 gigabytes
Virtual Memory: 64 terabytes
Single Edge Contact Cartridge (S.E.C), 242 pins
Package Dimensions: 5.505" (13.98cm) x 2.473" (6.28cm) x 0.647" (1.64cm)
Bus Speed: 66MHz
Typical Use: Business and consumer PCs, one and two-way servers and workstations

Mobile Pentium® Processor with MMX™ Technology (266 MHz)
Introduction date: January 12, 1998
Clock speeds: 266 MHz
Number of transistors: 4.5 million (0.25 micron process)
Bus width: 64-bit (Note: it is a 32-bit microprocessor)
Addressable memory: ~68 gigabytes
Package dimension: Tape Carrier Package (TCP) 320-pin
Typical use: mobile PCs and mini-notebooks

1997

Mobile Pentium® Processor with MMX™ Technology (200, 233 MHz)
Introduction date: September 8, 1997
Clock speeds: 200, 233 MHz
Number of transistors: 4.5 million (0.25 micron process)
Bus width: 64-bit (Note: it is a 32-bit microprocessor)
Addressable memory: ~68 gigabytes
Package dimension: Tape Carrier Package (TCP) 320-pin
Typical use: mobile PCs and mini-notebooks

Pentium® Pro Processor (200 MHz) with one megabyte of integrated Level 2 cache
Introduction date: August 18, 1997
Clock speeds: 200 MHz (8.66 SPECint95, 6.80 SPECfp95)
Number of transistors: 5.5 million (0.35 micron), 1mb L2 : 62 million (0.35 micron)
Bus width: 300 bits internal; 64 bits to L2 cache
Addressable memory: 64 gigabytes
Virtual memory: 64 terabytes
Pin count: 387 (Dual Cavity Pin Grid Array Package)
Package dimensions: 2.46 (6.25cm) x 2.66 (6.76cm)
Typical use: High-end desktops, workstations, and servers

Pentium® Processor (233 MHz) with MMX™ Technology
Introduction date: June 2, 1997
Clock speeds: 233 MHz (7.12 SPECint95, 5.21 SPECfp95. The iCOMP™ Index 2.0 rating is 203.)
Number of transistors: 4.5 million (0.35 micron CMOS)
Bus width: 64 bits (external data bus), 32 bits (address bus)
(Note: it is a 32-bit microprocessor)
Addressable memory: 4 gigabytes
Virtual memory: 64 terabytes
Pin count: 296 (Plastic Pin Grid Array Package)
Package dimensions: 1.95" (5cm) x 1.95" (5cm)
Typical use: High-performance desktops and servers

Pentium® II Processor (300, 266, 233 MHz)
See the die shot
Introduction date: May 7, 1997
Clock speeds: 300, 266, 233 MHz, Performance Data
Number of transistors: 7.5 million (0.35 micron), 512K L2
Bus width: 64 bit System Bus w/ECC; 64 bit Cache Bus w/opt. ECC
Addressable memory: 64 gigabytes
Virtual memory: 64 terabytes
Single Edge Contact cartridge (S.E.C.), 242 pins
Package dimensions: 5.505" (13.98cm) x 2.473" (6.28cm) x 0.647" (1.64cm)
Typical use: High-end business desktops, workstations, and servers

Pentium® Processor (200, 166 MHz) with MMX™ Technology
Introduction date: January 8, 1997
Clock speeds: 200, 166 MHz
Number of transistors: 4.5 million (0.35 micron CMOS)
Bus width: 64 bits (external data bus), 32 bits (address bus)
(Note: it is a 32-bit microprocessor)
Addressable memory: 4 gigabytes
Virtual memory: 64 terabytes
Pin count: 296 (Plastic Pin Grid Array Package)
Package dimensions: 1.95" (5cm) x 1.95" (5cm)
Typical use: High-performance desktops and servers

1996

Pentium® Processor (200 MHz)
See the die shot
Introduction date: June 10, 1996
Clock speeds: 200 MHz (5.17 SPECint95,4.32 SPECfp95. The iCOMP™ Index 2.0 rating is 142.)
Number of transistors: 3.3 million (0.35 micron BiCMOS)
Bus width: 64 bits (external data bus), 32 bits (address bus)
(Note: it is a 32-bit microprocessor)
Addressable memory: 4 gigabytes
Virtual memory: 64 terabytes
Pin count: 296 (Plastic Pin Grid Array Package)
Package dimensions: 1.95" (5cm) x 1.95" (5cm)
Typical use: High-performance desktops and servers

Pentium® Processor (166, 150 MHz)
See the die shot
Introduction date: January 4, 1996
Clock speeds: 166, 150 MHz
Number of transistors: 3.3 million (0.35 micron BiCMOS)
Bus width: 64 bits (external data bus), 32 bits (address bus)
(Note: it is a 32-bit microprocessor)
Addressable memory: 4 gigabytes
Virtual memory: 64 terabytes
Pin count: 296 (Pin Grid Array Package)
Package dimensions: 1.95" (5cm) x 1.95" (5cm)
Typical use: High-performance desktops and servers

1995

Pentium® Pro Processor (200, 180, 166, 150 MHz)
See the die shot
Introduction date: November 1, 1995
Clock speeds: 200, 180, 166, 150 MHz
Number of transistors: 5.5 million (0.35 micron), 256K L2: 15.5 million (0.6 micron), 512K L2: 31 million (0.35 micron)
Bus width: 64 bits front side; 64 bits to L2 cache
Addressable memory: 64 gigabytes
Virtual memory: 64 terabytes
Pin count: 387 (Dual Cavity Pin Grid Array Package)
Package dimensions: 2.46 (6.25cm) x 2.66 (6.76cm)
Typical use: High-end desktops, workstations, and servers

Pentium® Processor (133 MHz)
See the die shot
Introduction date: June 1995
Clock speeds: 133 MHz (218.9 MIPS, 4.01 SPECint95, 3.50 SPECfp95 on Xxpress 1MB L2)
Number of transistors: 3.3 million (0.35 micron BiCMOS)
Bus width: 64 bits (external data bus), 32 bits (address bus)
(Note: it is a 32-bit microprocessor)
Addressable memory: 4 gigabytes
Virtual memory: 64 terabytes
Pin count: 296 (Pin Grid Array Package)
Package dimensions: 1.95" (5cm) x 1.95" (5cm)
Typical use: High-performance desktops and servers

Pentium® Processor (120 MHz)
See the die shot
Introduction date: March 27, 1995
Clock speeds: 120 MHz (203 MIPS, 3.72 SPECint95, 2.81 SPECfp95 on Xxpress 1MB L2)
Number of transistors: 3.2 million (0.6 and .35 micron, BiCMOS)
Bus width: 64 bits (external data bus), 32 bits (address bus)
(Note: it is a 32-bit microprocessor)
Addressable memory: 4 gigabytes
Virtual memory: 64 terabytes
Pin count: 296 (Pin Grid Array Package)
Package dimensions: 1.95" (5cm) x 1.95" (5cm)
Typical use: Desktops and notebooks

1994

Pentium® Processor (75 MHz)
See the die shot
Introduction date: October 10, 1994
Clock speeds: 75 MHz (126.5 MIPS, 2.31 SPECint95, 2.02 SPECfp95 on Gateway P5 256K L2)
Number of transistors: 3.2 million (.6 micron, BiCMOS)
Bus width: 64 bits (external data bus), 32 bits (address bus)
(Note: it is a 32-bit microprocessor)
Addressable memory: 4 gigabytes
Virtual memory: 64 terabytes
Pin count: 320 Lead Tape Carrier Package (TCP)
296 Staggered Pin Grid Array (SPGA)
Package dimensions: PGA: 1.95" (5 cm) x 1.95" (5 cm)
TCP: 0.94" (2.4 cm) x 0.94" (2.4 cm)
Typical use: Desktops and notebooks.

Pentium® Processor (90 & 100 MHz)
See the die shot
Introduction date: March 7, 1994
Clock speeds: 90 MHz (149.8 MIPS, 2.74 SPECint95, 2.39 SPECfp95 on Gateway P5 256K L2)
100 MHz (166.3 MIPS, 3.30 SPECint95, 2.59 SPECfp95 on Xxpress 1M L2)
Number of transistors: 3.2 million (.6 micron, BiCMOS)
Bus width: 64 bits (external data bus), 32 bits (address bus)
(Note: it is a 32-bit microprocessor)
Addressable memory: 4 gigabytes
Virtual memory: 64 terabytes
Pin count: 296 (Pin Grid Array Package)
Package dimensions: 1.95" (5cm) x 1.95" (5cm)
Typical use: Desktops

IntelDX4™ Processor
Introduction date: March 7, 1994
Clock speeds: 75 MHz (53 MIPS, 41.3 SPECint92, 20.1 SPECfp92 on Micronics M4P 256K L2)
100 MHz (70.7 MIPS, 54.59 SPECint92, 26.91 SPECfp92 on Micronics M4P 256K L2)
Numbers of transistors: 1.6 million (0.6 micron)
Bus width: 32 bits
Addressable memory: 4 gigabytes
Virtual memory: 64 terabytes
Pin count: 168 PGA Package, 208 SQFP Package
Die size: 345 square mm
Typical use: High performance entry-level desktops and value notebooks

1993

Pentium® Processor (60 & 66 MHz)
See the die shot
Introduction date: March 22, 1993
Clock speeds: 60 MHz (100 MIPS, 70.4 SPECint92, 55.1 SPECfp92 on Xpress 256K L2)
66 MHz (112 MIPS, 77.9 SPECint92, 63.6 SPECfp92 on Xpress 256K L2)
Number of transistors: 3.1 million (.8 micron, BiCMOS)
Bus width: 64 bits (external data bus), 32 bits (address bus)
(Note: It is a 32-bit microprocessor.)
Addressable memory: 4 gigabytes
Virtual memory: 64 terabytes
Pin count: 273 (Pin Grid Array Package)
Package dimensions: 2.16" (5.49 cm) x 2.16" (5.49 cm)
Typical use: Desktops

1992

Intel486™ SL CPU
Introduction date: November 9, 1992
Clock speeds: 20 MHz (15.4 MIPS)
25 MHz (19 MIPS)
33 MHz (25 MIPS)
Addressable memory: 64 MBytes
Addressable virtual memory: 64 terabytes
Process size in microns: 0.8
Number of transistors: 1.4 million (0.8 micron)
Internal data path: 32 bits
External data path: 32 bits
Typical use: First CPU specifically designed for notebook PCs

IntelDX2™ Processor
Introduction date: March 3, 1992
Clock speeds: 50 MHz (41 MIPS, 29.9 SPECint92, 14.2 SPECfp92 on Micronics M4P 256K L2)
66 MHz introduced August 10, 1992 (54 MIPS, 39.6 SPECint92, 18.8 SPECfp92 on Micronics M4P 256K L2)
Number of transistors: 1.2 million (.8 micron)
Bus width: 32 bits
Addressable memory: 4 gigabytes
Virtual memory: 64 terabytes
Typical use: High performance, low cost desktops
Uses "speed doubler" technology where the microprocessor core runs
at twice the speed of the bus.
Minimum required performance, lowest cost desktops.

1991

Intel486™ SX CPU
Introduction date: April 22, 1991
Clock speeds: 16 MHz introduced September 16, 1991 (13 MIPS)
20 MHz (16.5 MIPS)
25 MHz introduced September 16, 1991 (20 MIPS, 12 SPECint92)
33 MHz introduced September 21, 1992 (27 MIPS, 15.86 SPECint92)
Number of transistors: 1,185,000 (1 micron); 900,000 (.8 process)
Bus width: 32 bits
Addressable memory: 4 gigabytes
Virtual memory: 64 terabytes
Typical use: Low-cost entry to Intel486™ CPU desktop computing.
Same as Intel486™ DX CPU with no math coprocessor on chip.
Upgradable with the Intel OverDrive processor.
Becoming standard processor in embedded applications.

1990

Intel386™ SL CPU
See the die shot
Introduction date: October 15, 1990
Clock speeds: 20 MHz (4.21 MIPS)
25 MHz introduced September 30, 1991 (5.3 MIPS)
Number of transistors: 855,000 (1 micron)
Internal architecture: 32 bits
External bus width: 16 bits
Addressable memory: 4 gigabytes
Virtual memory: 64 terabytes
Typical use: First microprocessor made specifically for portables
Highly integrated; includes cache, bus, and memory controllers

1989

Intel486™ DX CPU
See the die shot
50X performance of the 8088.
Introduction date: April 10, 1989
Clock speeds: 25 MHz (20 MIPS, 16.8 SPECint92, 7.40 SPECfp92)
33 MHz introduced May 7, 1990 (27 MIPS, 22.4 SPECint92 on Micronics M4P 128K L2)
50 MHz introduced June 24, 1991 (41 MIPS, 33.4 SPECint92, 14.5 SPECfp92 on Compaq/50L 256K L2)
Number of transistors: 1,200,000 (1 micron, with 50 MHz at .8 micron)
Bus width: 32 bits
Addressable memory: 4 gigabytes
Virtual memory: 64 terabytes
Typical use: Desktop computing and servers
Fifty times the performance of the 8088
Can scan the Encyclopedia Britannica in 3.5 seconds

1988

Intel386™ SX CPU
See the die shot
Introduction date: June 16, 1988
Clock speeds: 16 MHz (2.5 MIPS)
20 MHz introduced January 25, 1989 (2.5 MIPS)
25 MHz (2.7 MIPS)
33 MHz introduced October 26, 1992 (2.9 MIPS)
Number of transistors: 275,000 (1.5 microns, now 1 micron)
Internal architecture: 32 bits
External bus width: 16 bits
Addressable memory: 16 megabytes
Virtual memory: 256 gigabytes
Typical use: Entry-level desktop and portable computing

1985

Intel386™ DX CPU
See the die shot
Introduction date: October 17, 1985
Clock speeds: 16 MHz (5 to 6 MIPS)
20 MHz introduced February 16, 1987 (6 to 7 MIPS)
25 MHz introduced April 4, 1988 (8.5 MIPS)
33 MHz introduced April 10, 1989 (11.4 MIPS, 9.4 SPECint92 on Compaq/i 16K L2)
Number of transistors: 275,000 (1.5 microns, now 1 micron)
Bus width: 32 bits
Addressable memory: 4 gigabytes
Virtual memory: 64 terabytes
Typical use: Desktop computing
Can address enough memory to manage an eight-page history of every person on earth
Can scan the Encyclopedia Britannica in 12.5 seconds

1982

80286
See the die shot
Introduction date: February 1982
Clock speed: 6 MHz (0.9 MIPS)
10 MHz (1.5 MIPS)
12 MHz (2.66 MIPS)
Number of transistors: 134,000 (1.5 microns)
Bus width: 16 bits
Addressable memory: 16 megabytes
Virtual memory: 1 gigabyte
Typical use: Standard microprocessor for all PC clones at the time
Three to six times the performance of the 8086
Can scan the Encyclopedia Britannica in 45 seconds

80186
Introduction date: 1982
Note: Used mostly in controller applications

1979

8088
See the die shot
Introduction date: June 1979
Clock speeds: 5 MHz (0.33 MIPS)
8 MHz (0.75 MIPS)
Internal architecture: 16 bits
External bus width: 8 bits
Number of transistors: 29,000 (3 microns)
Typical use: Standard microprocessor for all IBM PCs and PC clones
Identical to 8086 except for its 8 bit external bus

1978

8086
See the die shot
Introduction date: June 8, 1978
Clock speeds: 5 MHz (0.33 MIPS)
8 MHz (0.66 MIPS)
10 MHz (0.75 MIPS)
Number of transistors: 29,000 (3 microns)
Bus width: 16 bits
Addressable memory: 1 Megabyte
Typical use: Portable computing
Ten times the performance of the 8080

1976

8085
Introduction date: March 1976
Clock speed: 5 MHz
0.37 MIPS
Number of transistors: 6,500 (3 microns)
Bus width: 8 bits
Typical use: Toledo scale. From weight and price computed cost.
High level of integration, operating for the first time on a single
5 volt power supply (from 12 volts previously)

1974

8080
See the die shot
Introduction date: April 1974
Clock speed: 2 MHz
0.64 MIPS
Number of transistors: 4,500 (6 microns)
Bus width: 8 bits
Addressable memory: 64 Kbytes
Typical use: Traffic light controller, Altair computer (first PC)
Ten times the performance of the 8008. Required six support chips versus 20 for the 8008

1972

8008
See the die shot
Introduction date: April 1972 (developed in tandem with 4004)
Clock speed: 200 kilohertz
0.06 MIPS
Number of transistors: 3,500 (10 microns)
Bus width: 8 bits
Addressable memory: 16 Kbytes
Typical use: Dumb terminals, general calculators, bottling machines
Data/character manipulation

1971

4004
See the die shot
Introduction date: November 15, 1971
Clock speed: 108 kilohertz
0.06 MIPS
Number of transistors: 2,300 (10 microns)
Bus width: 4 bits
Addressable memory: 640 bytes
Typical use: Busicom calculator
First microcomputer chip, arithmetic manipulation


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